The Pentapharm® BlisterPro™ computer simulation program introduces finite element analysis to blister pack thermoforming. The program provides thickness distribution, surface area, and permeability estimates of thermoformed cavities. These calculations allow package engineers to design optimal blisters around product shapes and barrier requirements.

• You can explore the effects of tool geometry, film types, and process conditions before running actual experiments.
• Evaluate barrier improvement and optimization for existing tools and films. Understand cause and effect while addressing constraints.
• Map out the range of options for both thermoformed cavity and machine layout, while addressing the necessary constraints and requirements of the blister package shape and barrier.
• Thickness distribution calculations often estimate measured values with better than 10% accuracy for both pressure forming and plug-assisted thermoforming applications.
• Assist film selection and provide package engineering support services.

Package designers, technicians, and engineers may use the program for a variety of projects.

• New package design
• Evaluate existing package design
• Troubleshooting
• Determine ideal forming process (pressure versus plug-assisted)
• Stability & production tool designs

Integrated with the other existing capabilities of kp’s Package Development Center, Pentapharm® BlisterPro™ can improve the film selection process and provide engineering support services to help with all your requirements.

• Avoid expensive production line trials
• Prevent costly tooling expenditures
• Avoid design pitfalls
• Excellent accuracy of blister MVTR prediction
• Develop blister packages by design

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